Items	Method	Condition	Unit	Typical Value
Tg	2.4.24.2	DMA	℃	190
	2.4.24	TMA		165
Td	2.4.24.6	5% wt. loss	℃	390
T288	2.4.24.1	TMA	min	＞60
T260	2.4.24.1	TMA	min	＞60
Thermal Stress	2.4.13.1	288℃, solder dip	-	PASS
CTE (Z-axis)	2.4.24	Before Tg	ppm/℃	30
		After Tg	ppm/℃	190
		50-260℃	%	2.1
Dissipation Constant (1GHz)	2.5.5.9	C-24/23/50, 1027RC75%	-	3.38
Dissipation Factor (1GHz)	2.5.5.9	C-24/23/50, 1027RC75%	-	0.0072
Volume Resistivity	2.5.17.1	C-96/35/90	MΩ.cm	3.87×109
Surface Resistivity	2.5.17.1	C-96/35/90	MΩ	1.72×107
Arc Resistance	2.5.1	D-48/50+D-0.5/23	s	182
Dielectric Breakdown	2.5.6	D-48/50+D-0.5/23	kV	＞45
Peel Strength (H Oz)	2.4.8	288℃/10s	N/mm	0.95
Flexural Strength (LW/CW)	2.4.4	A	MPa	510/490
Water Absorption	2.6.2.1	E-1/105+D-24/23	%	0.06
Flammability	UL94	C-48/23/50	Rating	V-0

Remarks:

1. Specification sheet: IPC-4101/130, is for your referenece only.
2. All the typical values listed above are for your reference only, please contact Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.