Items	Method	Condition	Unit	Typical Value
Thermal Conductivity	ASTM-D5470	A	W/ (m?K)	2.1
Thermal Impedance	ASTM-D5470	A	K·cm2/W	0.52
Tg	2.4.25D	DSC	℃	160
Td	2.4.24.6	Wt 5% loss	℃	395
Thermal Stress	2.4.13.1	288℃, solder float	min	30
CTE (Z-axis)	2.4.24	Before Tg	ppm/℃	17
		After Tg	ppm/℃	39
		50-260℃	%	0.69
Volume Resistivity	2.5.17.1	C-96/35/90	MΩ/cm	108
Surface Resistivity	2.5.17.1	C-96/35/90	MΩ	108
Dielectric Breakdown	2.5.6	D-48/50+D-0.5/23	kV	5.0
Hi-pot Test	GB/T-31988	DC	V	4000
		AC	V	3000
Peel Strength (1oz)	2.4.8	288℃/10s	N/mm	1.3
Flammability	UL94	C-48/23/50	Rating	V-0
MOT	UL	A	℃	130
CTI	IEC60112	A	Rating	PLC0

Remarks:

1. Typical value is based on specimen of 1.5mm Cu/1000μm dielectric/1oz Cu.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning inhours, the second digit the preconditioning temperature in ℃ andthe third digit the relative humidity.