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SF215C
Characteristic
●Low transparence, excellentlight-blocking.
●Flammability UL94 V-0.
●Excellent solderingreliability, chemical resistance and electrical properties.
●Low adhesive flowing, good processability,suitable for both fast and traditional lamination style.
●Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr6+,PBB,PBDE,etc..
Application Area
Coverlayfor FPC.
- Product Performance
- Product Certificate
- Data Download
Items | Method | Condition | Unit | Typical Value |
---|---|---|---|---|
Peel Strength (90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 0.71 |
288℃, 5s | 0.7 | |||
Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
Dimensional Stability | SY Method |
After peeling off the paper |
% | -0.0304/-0.0151 |
Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
>85 |
Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
4.1×108 |
Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
1.2×105 |
Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 4.22 |
Dissipation Factor (10GMHz) | SPDR |
C-24/23/50 |
- | 0.0405 |
Resin Flow | IPC-TM-650 2.3.17.1 |
180℃/10+60s,100kg/cm2 |
mm | <0.15 |
Flammability | UL94 |
E-24/125 |
Rating |
V-0 |
Remarks:
* Certified to IPC-4203/2 Epoxy adhesive on one or two sidesof poyimide dielectric