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SF206B
Characteristic
Low dielectric constant, low dissipation loss
The copper has excellent peel strength with the PI film
Halogen-free, flammabilityUL94 VTM-0
Excellent thermal agingresistance ,chemicalresistance and electrical property
Good processability, suitable for traditional lamination style.
Compatible with EU RoHSdirective, freeof Pb,Hg,Cd, Cr6+,PBB,PBDE, etc ..
Application Area
Be used in high frequency multi-layer FPC and rigid-flex PCB as the bonding lay- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength(90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.1 |
| 288℃、5s | 1.1 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃、10s | - | No delamination |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % | ＞90 |
| Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 118.9 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm | 4.1×109 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ | 1.4×106 |
| Dielectric Constant(10GHz) | SPDR | C-24/23/50 | - | 2.5 |
| Dissipation Factor(10GHz) | SPDR | C-24/23/50 | - | 0.003 |
| Resin Flow | IPC-TM-650 2.3.17.1 | 180℃/10+60s,100kg/cm2 | mm | ＜0.15 |
| Flammability | UL94 | E-24/125 | Rating | V-0 |
Remarks:
*Testing after laminating with shining side of copper foil in suitablecondition.
1.Certified to IPC-4203/20 Unsupported polyesteradhesive
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.