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S7045G
Characteristic
● Tg＞170℃ (DSC)，HFR-free● Dk/Df@1GHz: 4.30/0.010
● Low Z-axis CTE, with good processibility
● Good anti-CAF performance
Application Area
PC server, line card, computer peripherals- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 175 | |
|
IPC-TM-650 2.4.24.4 |
DMA |
℃ |
190 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 390 | |
| CTE（Z-axis） | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 40 | |
| After Tg | ppm/℃ | 210 | |||
| 50-260℃ | % | 2.3 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- |
PASS |
|
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.30 | |
| IPC-TM-650 2.5.5.5 | 10GHz | -- | 4.15 | ||
|
IEC 61189-2-721 |
10GHz | -- | 4.50 | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.0100 | |
| IPC-TM-650 2.5.5.5 | 10GHz | -- | 0.0130 | ||
|
IEC 61189-2-721 |
10GHz | -- | 0.0130 | ||
| Peel Strength(1oz RTF copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.0 | |||
| 125℃ | N/mm | — | |||
| Water Absorption |
|
85℃/85%RH,168Hr | % | 0.12 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Remarks:
1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.