S1190
Characteristic
● Superior thermal resistance● Very low Z-CTE
● Excellent Anti-CAF performance
Application Area
● Suitable for high-layer count PCB- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.24.4 | DMA | ℃ | 200 | |
| Tg |
|
TMA |
℃ |
170 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 350 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
| After Tg | ppm/℃ | 210 | |||
| 50-260℃ | % | 2.3 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 45 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | s | >100 | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 2.51E+08 | |
| E-24/125 | MΩ.cm | 1.88E+06 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 3.29E+07 | |
| E-24/125 | MΩ | 2.38E+06 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 146 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | >45 | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.6 | |
|
IPC-TM-650 2.5.5.9 |
1MHz | -- | 4.8 | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.015 | |
|
IPC-TM-650 2.5.5.9 |
1MHz | -- | 0.009 | ||
| Peel Strength (1oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.25 [7.14] | |||
| 125℃ | N/mm | — | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 530 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 410 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.07 | |
| CTI | IEC60112 | A | Rating | PLC 3 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Remarks:
1. Specification sheet: IPC-4101/126, is for your reference only.
2. All the typical value is based on the 1.6mm specimen, while the Tg is for specimen≥0.50mm.
3. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.